Smart Engineering
It is our objective to design less expensive device, more reliable and easier for manufacturing.
The more expensive competitors device uses more components and larger PCB with the same performance The Flir Thermal Imager Camera is use to final test of the prototype performance and check for Debugging with Microchip ICE3 support and Keysight high performance Oscilloscope is most efficient and fastest deign.
Gallery
![Debugging with Microchip ICE3 support and Keysight high performance Oscilloscope is most efficient and fastest deign](img/smart/1.jpg)
![Smart Engineering as the add value to our customers. Less expensive device, more reliable and easier for manufacturing](img/smart/2.jpg)
![The Flir Thermal Imager Camera is use to final test of the prototype performance](img/smart/3.jpg)
![The more expensive competitor device is uses more components and larger PCB with the same performance](img/smart/4.jpg)
![The PCB 3D visualization](img/smart/5.jpg)
![Pick and Place visual system rejected any component not matching the specification](img/smart/6.jpg)
![Solid Work CAD design platform creates the enclosure for our electronics](img/smart/7.jpg)
![The array of the boards lowers the assembling cost and decreases the delivery time](img/smart/8.jpg)